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Encapsulation Cups
Globe has manufactured a full line of EC™ Encapsulation Cups since 1979. They are molded from Diallyl Phthalate in order to withstand the high temperatures and harsh chemicals utilized in electronics assembly.
These cups eliminate the need for encapsulation molds, and reduce the size of encapsulated component packages.
Available in round or rectangular configurations from .1" square to 3" square.
Email or Call for a quotation.
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